We carry out consistently from design, manufacturing to start of product with our high precision and reliable mechatronics technologies we have built while developing labor-saving and automated equipment along with our detailed customized services we have nurtured while delivering custom-made products.

• To meet the rapidity of technological innovation in semiconductor industry, we focus on developing leading-edge process technologies.
• We propose next-generation process/method by providing high-level semiconductor packaging process and high precision mounting equipments to customers.

• Making use of our proven experience and expertise along with multitude of sales performance, we contribute to provide high reliable automatic insertion system for discreet electronic parts such as axial, radial and odd-shaped components.
• We have established highly accurate coating process to narrow area and provide film thickness uniformity regarding to the conformal coating on a electric substrate and precise coating of fluorescent and sealant on LED substrate.

We provide automated assembly line for manufacturing LED lamp by adopting high precision and reliable transfer system we have nurtured while developing custom-made equipments. By taking advantage of our high process technological capabilities we have gained through providing semiconductor packaging process to customers, we diversify our business into LED module manufacturing market.